Deep Reactive Ion Etch (DRIE)
These products deliver exceptional process control at high productivity for several critical and non-critical deep silicon etch applications.
Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)
Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.
Reactive Ion Etch (RIE)
These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE) Reliant Systems
The refurbished and newly built Reliant products offer reliable, production-proven solutions at low cost of ownership for conductor, dielectric, and metal etch applications.
Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.
Atomic Layer Etch (ALE) Deep Reactive Ion Etch (DRIE)
Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.
Deep Reactive Ion Etch (DRIE) Reactive Ion Etch (RIE)
For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.
Designed for the Sense.i platform, Vantex redefines high aspect ratio etching with innovations in technology and Equipment Intelligence.
These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.