Process: Etch

Designed for high-volume production with maximum process yield, Akara® increases wafer output and eliminates wasted time, with millisecond response times to any change. The industry’s most advanced etch uniformity controls provide angstrom-level critical dimension uniformity and wafer to wafer repeatability.

Coronus systems focus on the bevel edge to enhance overall yield. Semiconductor processing can cause residues and roughness to accumulate along the wafer edge where they may flake off, drift to other areas, and create defects that cause a device to fail. Coronus etch products remove bevel residues and Coronus deposition protect the wafer bevel from damage.

Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

These market-leading conductor etch products deliver the high-performance precision and control at high productivity needed for critical device features.

Our Reliant etch products enable roadmaps for Specialty Technologies and extend the productive life of fabs.

Breakthrough portfolio delivers isotropic material removal with angstrom-scale precision and ultra-high selectivity capabilities for 3D architectures and advanced logic and foundry applications.

Our latest etch platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity.

For deep etch applications, this product family provides the exceptional across-wafer uniformity control needed for critical high aspect ratio features.

Designed for the Sense.i platform, Vantex redefines high aspect ratio etching with innovations in technology and Equipment Intelligence.

These metal etch products provide excellent process control at high-productivity for electrical connection and metal hardmask applications.