Advanced Packaging Archives - Lam Research
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Solution: Advanced Packaging

ALTUS Product Family

Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD)

Combining CVD and ALD technologies, these market-leading systems deposit highly conformal metal films for advanced tungsten metallization applications.

Coronus Product Family

Plasma Bevel Etch and Deposition

Coronus systems focus on the bevel edge to enhance overall yield. Semiconductor processing can cause residues and roughness to accumulate along the wafer edge where they may flake off, drift to other areas, and create defects that cause a device to fail. Coronus etch products remove bevel residues and Coronus deposition protect the wafer bevel from damage.

DSiE Product Family

Deep Reactive Ion Etch (DRIE)

These products deliver exceptional process control at high productivity for several critical and non-critical deep silicon etch applications.

DV-Prime & Da Vinci Product Families

Wet Clean/Strip/Etch

These products provide the process flexibility needed with high productivity to address multiple wafer cleaning steps throughout manufacturing.

Flex Product Family

Atomic Layer Etch (ALE) Reactive Ion Etch (RIE)

Our dielectric etch systems offer application-focused capabilities for creating a wide range of challenging structures in advanced devices.

Galaxy Product Family

Wet Clean/Strip/Etch

The Galaxy platform combines years of experience in batch wafer processing with advanced process control typically only found on single wafer tools.

Kallisto Product Family

Dielectric Developement Electrochemical Deposition (ECD) PR-Development PR-Strip Wet Clean/Strip/Etch

An advanced vertical processing platform for wet chemical treatment of substrates from 300x300mm up to Gen 5.1 (1100 x 1300mm) tailored to the needs of semi industry.

Metior Product Family

Mass Metrology

Our mass metrology systems deliver sub-milligram measurement capability for advanced process monitoring and control of three-dimensional device structures.

OverViz

Plasma Modeling

OverViz™ is an industrial simulation software platform for high-fidelity modeling of plasma discharges.

Phoenix Product Family

Dielectric Developement Electrochemical Deposition (ECD) PR-Development PR-Strip Wet Clean/Strip/Etch

Phoenix offers a fully-automated high volume panel processing for 510x515mm substrates.

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